Wafer Charging Monitors Latest Research

Wafer Charging Monitors, Inc.

Latest Research!

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W. Lukaszek, How to Avoid Charging Damage in IC Manufacturing, International Semiconductor Technology Conference, Shanghai, China, September 14-17, 2004.
W. Lukaszek, M. I. Current, S. Daryanani, L. Larson, T. Rhoad, J. Shields, M. Vella, and D. Wagner, Investigation of Electron-Shading Effects during High-Current Ion Implants, 8th International Symposium on Plasma- and Processed-Induced Damage, Corbeil-Essonnes, France, April 24-25, 2003.
W. Lukaszek, S. Daryanani, and J. Shields,Charging on Resist-Patterned Wafers During High-Current Ion Implants, 14th International Conference on Ion Implantation Technology, Taos, NM, September 22-27, 2002.
W. Lukaszek, Use of EEPROM-based Sensors in Investigating Physical Mechanisms Responsible for Charging Damage, 40th Annual International Reliability Physics Symposium, Dallas, TX, April, 2002.
S. Siu, et al., Utility of CHARM-2 in Diagnosing Sources of Plasma Charging Damage in High Density Etchers and in Assisting Hardware Development, 6th International Symposium on Plasma Process-Induced Damage, Maui, HI, June 5-7, 2002.
S. Gu, et al., Impact of F Species on Plasma Charge Damage in a RF Asher, 6th International Symposium on Plasma Process-Induced Damage, Maui, HI, June 5-7, 2002.
C.K. Barlingay, et al., Mechanism of Charge Induced Plasma Damage to EPROM Cells During Fabrication of Integrated Circuits, 6th International Symposium on Plasma Process-Induced Damage, Maui, HI, June 5-7, 2002.
W. Lukaszek and J. Shields, Electron Shading Effects During Oxide Etching in Uniform and Non-Uniform Plasmas, 6th International Symposium on Plasma Process-Induced Damage, Maui, HI, June 5-7, 2002.

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1. How to Avoid Charging Damage in IC Manufacturing
2. Investigation of Electron-Shading Effects during High-Current Ion Implants
3. Charging on Resist-Patterned Wafers During High-Current Ion Implants
4. Use of EEPROM-based Sensors in Investigating Physical Mechanisms Responsible for Charging Damage
5. Utility of CHARM-2 in Diagnosing Sources of Plasma Charging Damage in High Density Etchers . . .
6. Impact of F Species on Plasma Charge Damage in a RF Asher
7. Mechanism of Charge Induced Plasma Damage to EPROM Cells During Fabrication of Integrated Circuits
8. Electron Shading Effects During Oxide Etching in Uniform and Non-Uniform Plasmas

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